Intel reports processing over one million High‑NA EUV wafers, approaching worldwide total

Intel announced that it has processed upwards of one million wafers using High‑Numerical Aperture (High‑NA) extreme ultraviolet (EUV) lithography equipment, a milestone that brings the firm near the global total for this advanced technology.

The newest class of lithography gear, High‑NA EUV, allows manufacturers to etch circuit details at unprecedentedly small scales, facilitating the shift to 3‑nanometer and even tighter process nodes. These tools are provided solely by ASML, a Dutch company whose technology is viewed as the limiting factor for cutting‑edge semiconductor production.

Intel says the one‑million‑wafer count encompasses every use of the new scanners, ranging from qualification and R&D runs to full‑blown production. The number mirrors the firm’s rapid deployment of High‑NA EUV in its latest fabs, such as the newly inaugurated sites in Arizona and Ohio that target high‑performance computing and artificial‑intelligence applications.

ASML states that, globally, 1.35 million High‑NA EUV wafers have been processed so far, indicating that Intel’s share accounts for about three‑quarters of the total. The balance is divided among a few competitors, principally Taiwan’s TSMC and South Korea’s Samsung, each of which is also growing its High‑NA capacity, albeit more gradually.

This achievement holds strategic significance for Intel, which has been striving to narrow the technology gap with TSMC and Samsung. By capturing a leading portion of High‑NA throughput, Intel seeks to reinforce the U.S. semiconductor supply chain, a goal highlighted by recent government programs aimed at expanding domestic chip manufacturing.

Going forward, Intel plans to keep raising wafer throughput on its High‑NA machines as additional lines are commissioned and yield gains materialize. Analysts anticipate that the firm’s upcoming processor family, scheduled for release later this year, will leverage the superior patterning ability, possibly tightening the performance advantage currently enjoyed by its Asian rivals.